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ADT
is
a world leader in the development and manufacture of dicing saws and laser
scribing systems, dicing blades and processes used in the dicing of
silicon-based ICs, hard material Microelectronic Components (MECs) and in
package singulation. |
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Hall
B1
Booth 142 |
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Contact:
Yossi Gershon (for Dicing Systems) and
Ms. Miri Benita will help you with Dicing Blade questions.
ADT will not this year exhibiting any system. |
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AUREL
AUREL Automation is
specialized
machines for material deposition and creation of precision-patterns. Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces for automatic production lines. |
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Hall A2
Booth 481 |
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Contact:
Fabio Pagnotta
Screen printers , stand alone, in-line, for thick film, LTCC, green
energies, sensors. Lasers for trimming, marking, cutting. Work Cell for
ink-jet of nano materials, microdispensing, DOD, inspections. |
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JFP
Microtechnic
Very new is the Model PP400 semiautomatic and PP400M manual Die Bonder,
(however not shown at the exhibition, but could be discussed at the booth). |
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Hall B2
Booth 356 |
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Contact:
François Palomares and Didier Magne,
JFP will show their Model
PP5-6 Flip-Chip die bonder and PP-One, manual die placement. |
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UniTemp
Thermal Process ovens
for laboratory and
pre-production requirement. Hotplates/ workstages (workholders). |
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Hall B2
Booth 356 |
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Contact:
Dr. Christopher Curran and Astrid Birkner
UniTemp
will exhibit their new Model
RSS-110-S/ RSS-160-S as well as the Model RSS-210-S Reflow Soldering
Systems. A brand new Wire Bonder Model WB-200. |
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