The deep access wedge design was created to
meet the challenge of bonding into deep cavity packages. The high walls of
these packages make access with conventional 30° , 45° , and 60° wedge
bonders very difficult.
With a conventional bonder, the position of
the wire clamps behind the bonding wedge limits access in the deep package.
Also, the wire may be impeded between the wire clamps and the wedge by these
The deep access wedge bonder feeds the wire
vertically down the center of the tool. The wire clamp is located above the
wedge instead of behind the
wedge. This clamp position allows the wedge to
penetrate deep cavity packages.
The deep access bonding wedge is a combination
of both a wedge and a capillary. The wire travels through the center of the
wedge shank, exits down toward the bottom, out the back of the shank, and
through the wire feed hole at either a 45° or
60° angle. This innovation in wedge bonding has provided the opportunity for
small bond lengths into deep cavity packages.