GTC Capillary Information 14 - Ball Bonding Problems



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GAISER CAPILLARY INFORMATION

14. BALL BONDING PROBLEMS

GTC Figure 52

Figure 52. Several reasons can lead to the cratering of the bond pads. Some of them are:

	Excessive power setting
	Work piece movement during bonding
	Adhesion of the metallization to active device (Note: this is not true cratering.)
	Bond time is too long
	Bond stage temp is too high
	Bond pad metallization is too hard and/or thin

Figure 53. Necking above the ball bond can occur for several reasons:

	Insufficient force on the tool allowing the ball to wobble during scrubbing
	Free-air ball size too small, which is captured within the inside chamfer
	Incorrect percent elongation of the wire allowing the wire to work harden during formation

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