DFS-200, BMR Technology Corporationís plasma asher, is a downstream
plasma asher designed for plasma-damage-free photoresist ashing based on
proprietary inductively coupled plasma technology.
Its unique capability of tight wafer temperature control makes DFS-200
particularly useful for photoresist ashing of temperature sensitive
DFS-200ís fully automated vacuum cassette wafer loading system provides
cost-effective high throughput photoresist ashing for mass production.